SK Hynix: No HBM Hybrid Bonding Unless 90% Yield and 3-Year Lifespan Achieved

SK Hynix said it will not adopt hybrid bonding for HBM mass production until the technology achieves 90% yield and a three-year lifespan. The stance reflects a cautious approach to advanced packaging yield and reliability, avoiding early adoption that could raise costs and hurt customer confidence. If the targets are met, it could strengthen the company's technical moat in next-generation products like HBM4, supporting the stock over the medium term.

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